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SC8800D
SC8800D TD-SCDMA/GSM/GPRS Multimedia Baseband Chip
  

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Spreadtrum’s SC8800D is a single TD-SCDMA/GSM/GPRS dual mode baseband chip, which is the world's first TD-SCDMA dual-mode chip providing analog, digital and power management, plus multimedia application functions on a single chip. SC8800D offers automatic handover between TD-SCDMA and GSM networks, with up to 384 kbps downlink transmission data rates, and multimedia features for the 3G market.

The SC8800D features a highly integrated chipset that enhances reliability, reduces production costs and helps customers develop new products and bring them to market faster.
SC8800D Baseband Chip Diagram
SC8800D Key Features
Core Description ▪ ARM926EJ-S® core, clock speeds up to 100MHz
Data Transmit Capability ▪ PS uplink 128kbps/ downlink 384kbps
Multimedia Support For ▪ Build-in MP3 player
▪ 64-polyphonic melody (MIDI based)
LCD Display Features ▪ Built-in LCD Controller
▪ Support for dual color LCD display modules
▪ Support up to 262 K TFT/OLED display modules
▪ Support up to 240x320 resolution size LCD display modules
Memory I/F Support For ▪ Memory interfaces (SDRAM, NAND, NOR)
▪ Built-in NAND flash controller
▪ NAND booting
▪ NAND+SDRAM multi-chip packaging (MCP)
Peripheral I/F Support For ▪ MMC and SD card interfaces
▪ 3 UART interfaces, with transmission speeds up to 1.152 Mbps
▪ IrDA with transmissions speeds up to 115kbps
▪ SPI interfaces
▪ I²C interfaces
▪ I²S interfaces
▪ GPIO interfaces
▪ 1.8/3.0 SIM interface
▪ JTAG interface for test and in-circuit emulation
▪ Real-Time Clock (RTC) synchronization
Analog I/F Features ▪ Wide range RF interface support for IF/NZIF/ZIF architectures
▪ Power management with Low Drop Output (LDO) regulators on chip
Firmware Support For ▪ GSM/GPRS standards (release V8.2.0 12/1999),
  GSM850/GSM900/DCS1800/PCS1900
▪ GPRS Multi-Slot Class 10
▪ TD-SCDMA standards (3GPP release 5), 2010~2025MHz
▪ FR, EFR, AMR
▪ Voice recording
▪ A5/1 and A5/2 encryption algorithms
Other Features ▪ Operating ambient temperature range: -25 to +65 degrees centigrade
▪ Extremely low-power design, 3.0V for I/O, 1.8V for core
▪ 13×13mm² 289-ball LFBGA package

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