| Core Description |
▪ ARM926EJ-S® core, clock speeds up to 100MHz |
| Data Transmit Capability |
▪ PS uplink 128kbps/ downlink 384kbps |
| Multimedia Support For |
▪ Build-in MP3 player
▪ 64-polyphonic melody (MIDI based) |
| LCD Display Features |
▪ Built-in LCD Controller
▪ Support for dual color LCD display modules
▪ Support up to 262 K TFT/OLED display modules
▪ Support up to 240x320 resolution size LCD display modules |
| Memory I/F Support For |
▪ Memory interfaces (SDRAM, NAND, NOR)
▪ Built-in NAND flash controller
▪ NAND booting
▪ NAND+SDRAM multi-chip packaging (MCP) |
| Peripheral I/F Support For |
▪ MMC and SD card interfaces
▪ 3 UART interfaces, with transmission speeds up to 1.152 Mbps
▪ IrDA with transmissions speeds up to 115kbps
▪ SPI interfaces
▪ I²C interfaces
▪ I²S interfaces
▪ GPIO interfaces
▪ 1.8/3.0 SIM interface
▪ JTAG interface for test and in-circuit emulation
▪ Real-Time Clock (RTC) synchronization |
| Analog I/F Features |
▪ Wide range RF interface support for IF/NZIF/ZIF architectures
▪ Power management with Low Drop Output (LDO) regulators on chip |
| Firmware Support For |
▪ GSM/GPRS standards (release V8.2.0 12/1999),
GSM850/GSM900/DCS1800/PCS1900
▪ GPRS Multi-Slot Class 10
▪ TD-SCDMA standards (3GPP release 5), 2010~2025MHz
▪ FR, EFR, AMR
▪ Voice recording
▪ A5/1 and A5/2 encryption algorithms |
| Other Features |
▪ Operating ambient temperature range: -25 to +65 degrees centigrade
▪ Extremely low-power design, 3.0V for I/O, 1.8V for core
▪ 13×13mm² 289-ball LFBGA package |
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